Higher system speeds have necessitated consideration of signal propagation delay and quality not just within electronics, but through wire harnesses. Tighter form factors have minimized the typical “board in a box,” where a simple rectangular board had enough clearance that there were rarely problems. Rigid/flex circuits often stress cross-domain ECAD/MCAD design with their multiple stack-ups and bendability. And even if form/fit is achieved, high-performance systems with significant heat dissipation need to ensure adequate air/fluid flow through the structure.

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Annular ring is the amount of copper left and surrounding the hole after processing. This measurement is taken from the edge of the hole to the edge of the land at the thinnest part. To ensure a robust design, we must design efficient annular ring for PCB interconnections. From my field experience, annular ring design is a misunderstood aspect of printed circuit board (PCB) design. Not because it is complex; it is a dry subject with a few moving parts.

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One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB. The other use for a final finish is to provide a known contact resistance and life cycle for connectors, keys, or switches. The primary purpose of a final finish is to create electrical and thermal continuity with a surface of the PCB.

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