Check out this week's Design007 Week Newsletter.
February 25, 2021 

Managing Footprints With Integrated EDA Tools

Matt Walsh, Siemens Digital Industries Software

Electronics companies are always under great pressure to continually grow and innovate. In addition to navigating ever-accelerating design cycles, they must also address and overcome generational complexities associated with their products, the underlying components they use, and the human capital accountable for delivering on time and on budget... More >

 
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Altium Introduces New Subscription Model

Andy Shaughnessy, Design007

Andy Shaughnessy chats with Lawrence Romine about Altium’s new subscription model for their Altium 365 platform. They discuss what this means for existing and future Altium customers, and some of the drivers leading to this development, including evolving use patterns among customers during the pandemic.

More >

 
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EPTE Newsletter: Powerful Earthquake Hits Japan

Dominique Numakura, DKN Research

On Saturday, February 13, 2021 my family and I were reminiscing about the Great East Japan Earthquake that happened almost 10 years ago. Later, about 11 pm, my cellphone rang with an emergency alert, just as my house started to shake... More >

 
This Month's Jobs
Multiple Positions: Atlanta Georgia Facility

We're Hiring!

ADVANCED CIRCUITRY INTERNATIONAL is a world class supplier of RF/microwave and antenna PCBs. We have four state-of-the-art facilities on three continents to serve our customers...

Apply Now

 
Planning Engineer/Quality Engineer/Sales Associate

Illinois-based PCB fabricator, Circuit Engineering, is now seeking to fill a variety of positions at their Elk Grove Village facility including Planning Engineer, Quality Engineer/Manager and Sales Associate/Customer Service...

Apply Now

 

More Job Opportunities >
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Current Design007 Magazine Table of Contents


Footprints and Library Management

Many designers count footprints among their most common headaches. This is a critical point in the design process; errors at this stage can wind up having ramifications far downstream. Something as simple as an incorrect pad size can lead to bad solder joints or components floating during reflow...
Download the PDF of this magazine to your library.


FEATURES:

  • Best Practices for Footprint Design and CAD Library Management, a conversation with John Watson, CID
  • Footprint Design Techniques: Don’t Trust Datasheets, a conversation with Tom Hausherr, CID+
  • Managing Footprints with Integrated EDA Tools, by Matt Walsh, Siemens EDA
  • A Library Management Cautionary Tale, by Stephen V. Chavez, CID+
  • Circuit Material Library Considerations, by John Coonrod
  • The Case for Expansive Parts Libraries, by Bob Tise
  • Footprints—Small Steps with a Giant Impact, Kelly Dack, CID+


 
 
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