I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

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Here we are in the 21st century, technology abounds across all sectors, and it continues to grow. Advances in wearable technology, vehicles with driver assistance features, and integrated smart home electronic devices continue to drive demand and innovation in the PCB industry. The product development teams tasked with taking these technologies from design into reality are often stuck using procedures from the last century.

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Designing with manufacturing, rather than for manufacturing is much more than a buzz word. New materials and processes, and new and developing design rules make collaborating with your PCB fabricator a necessity more than ever before. I sat down with Meredith LaBeau, CTO of Calumet, to learn her thoughts about bringing a new technology to commercialization and the importance of PCB designers working closely with their preferred fabricators to be most successful when implementing designs with feature sizes previously not available.

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