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New Functionality Improves Designer’s Productivity
I originally came up with the concept of an online impedance calculator way back in 1994 when I was working on the PCB layout and design for a new generation of SPARC 20 servers. We basically reformatted a Sun SPARC 20 pizza box motherboard to fit into a 5.25-inch drive slot. This was of course a tight exercise, but my idea was this: If I could physically fit all the required chips and connectors on the board, then it could be routed. This design required a 12-layer motherboard, and I used the IPC-317 “Design Guidelines for Electronic Packaging Utilizing High Speed Techniques” closed-loop equations to determine the signal layer impedance. The maximum CPU frequency was 200MHz, so there was plenty of margin.


Flexible Thinking: The Benefits of Employing a Standard Grid Pitch in Design
The industry at large needed to jump on the learning curve and overcome its fear of the unknown. One of the most vexing concerns at the time (an arguably still today) is that terminations beneath the area array package were unseeable. Given the fact that then, as today, solder joints were a major cause of failure, there was much consternation over the quality of the joints. However, in the industry’s rush to take immediate satisfaction of the benefits of area array packaging, it collectively failed to consider some highly significant overall benefits made possible by area array packaging—the potential to design assemblies with every component having terminations that could land on a standard grid.

Ultra Librarian – Tired of Building Symbols, Footprints, and 3D Models? -- You lose precious time creating symbols and footprints, causing missed deadlines and setbacks. With Ultra librarian for OrCAD, you now have access to over 8 million prebuilt parts without ever leaving your design environment. Stop wasting time building parts, and start creating innovative products with Ultra Librarian for OrCAD. Watch the video for more information.


RTW IPC APEX EXPO: John Davignon Offers HDPUG Update
The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.


EIPC Workshop on PCB BioMEMS
The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-onchip.


Design News & Additional Information

I-Connect007 Launches The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs – Part 1 Micro eBook
I-Connect007 is excited to announce the release of the next book in our micro eBook Design series: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 1, by Polar Instruments.

DownStream Technologies Posts 15% Year-to-Year Sales Growth
DownStream Technologies has posted revenue increase of 15% overall in 2016 as compared to 2015. The driving factor behind these strong numbers was a continued demand across the entire product line including a 50% increase in sales from DFMStream and a 33% increase from BluePrint-PCB, as both products continue to lead the industry in their respective categories.

ESD Alliance: EDA Industry, PCB Post Revenue Growth in Q4
The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) has announced that the Electronic Design Automation (EDA) industry revenue increased 18.9% for Q4 2016 to $2.4 billion, compared to $2.06 billion in Q4 2015. PCB & MCM earned revenue of $235.4 million for Q4 2016, an increase of 42.5% over the same period in 2015.

Milwaukee Electronics Creates New Position in Design Engineering Group
Milwaukee Electronics has promoted Larry Holten to the newly created position Technical Sales – Manager of Special Accounts in the Design Engineering group.

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