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In With the New at Cadence
The next generation of PCB designers is coming—slowly, but surely. What will this new group of designers mean for EDA vendors like Cadence Design Systems? Andy Shaughnessy recently interviewed Dan Fernsebner, product marketing group director and a veteran EDA guy, and Bryan LaPointe, lead product engineer and representative of the younger generation. They discussed the next generation of PCB designers, some of the best ways to draw smart young people into this industry, and why the PCB designers of the future may need to have a college degree just to get an interview.















  

Tim's Takeaways: Where Have All the Designers Gone (and Who Will be Taking Their Place)?
We have a lot to pass on to the new designers. We must stress the importance of understanding of the roots of our industry and why this design knowledge is important. I have worked with many designers who don’t understand anything about the output of their design files. They go through a procedure, hit a series of commands, and presto: The design files are all wrapped up in a neat little zip file ready to go out to the manufacturer. That’s all well and good, until something breaks or a manufacturer has a specific question. It would be a great thing to make sure that the designers of tomorrow understand what a Gerber file and an aperture list really is.

Optimize your high-speed PCB and IC package interconnects with an integrated 3D design and 3D analysis environment. Bridge the gap between mechanical components and electronic design of PCB and IC packages to quickly and accurately analyze signals that cross multiple boards. Discover new Sigrity™ 3D technologies.

 

Beware of Customer Concentration Risk
One of the biggest risks in M&A is customer concentration risk. It is hard to avoid as a business owner; if a customer is giving you orders, you generally take them! The next thing you know, your customer has 90% of your sales and they own you. We see this a lot in both the PCB and contract manufacturing industries.

  


How DFA Converts Complexity into Freedom for Medical Device Development
The assembly of medical devices comprising electronic and mechanical components has become an increasing challenge as devices grow more complex, functional and compact, and as they undergo increasingly frequent product refresh cycles. Read on to find assembly techniques that will help manufacturers to deliver highly engineered and integrated products.

 

Design News & Additional Information


Amkor Package Assembly Design Kit Supports Mentor’s HDAP Tools
Amkor Technology, Inc. announced it has partnered with Mentor to release Amkor’s SmartPackage™ package assembly design kit (PADK), the first in the industry to support Mentor’s high-density advanced packaging (HDAP) design process and tools.


August Issue of Design007 Magazine Available Now
Over the past 60 years, packages have continued to shrink. The transistor outline “metal cans” of the 1950s would look out of place today. Some packages are no bigger than the period at the end of this sentence, complete with their own “inhalation warning.” Learn more in this month's issue of Design007 Magazine.


Polar Instruments Releases Updates on Speedstack Tool
Polar Instruments released detailed information documenting recent changes and improvements to their Speedstack tool for rigid PCB layer stackup design and documentation.


Occam Prize Competition for Electronic Design Now Accepting Entries
The first annual Occam Prize International Design Competition has begun accepting registrations from circuit designers from around the world wishing to participate.

For all the latest Printed Circuit Board Design news and information, go to PCBDesign007 right now!



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