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MIL-AERO Weekly Newsletter
  6/28/2016 Current Mil/Aero News: MilAero007 | Mil/Aero Events | Subscriptions
This Week's Feature    
 

Today’s MilAero Options: Outsourcing—‘Everybody’s Doing it’ Not so True Today
There was a time, not so many decades ago, when that most commonly-stated mantra (“lower labor costs”) behind offshoring printed circuit fab (and some assembly) operations, still had some case-by-case validity.

  Top Story
 

Against the Density Wall: Landless Vias Might be the Answer
I saw my first landless via multilayer while visiting NEC in Japan in 1985. You may not know much about landless vias. This has been a well-kept secret for the last 30 years, possibly because it is not permitted on military boards, and therefore, discouraged in all IPC standards. So when a company showed us their landless via boards, we said, "You can't do that!"

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