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MIL-AERO Weekly Newsletter
  6/20/2017 Current Mil/Aero News: MilAero007 | Mil/Aero Events | Subscriptions
This Week's Feature    
 

Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization
Hofmann Leiterplatten GmbH has developed a wide range of products during in 25 years. New manufacturing know-how has been developed in fabricating organic PCB with embedded devices. A special name “AML” (Active Multi Layer)[1] was created to differentiate the surface mount devices (SMD) and the device embedded technology (DET) PCBs. Manufacturing processes that are not typical for standard PCB fabrication shops has been developed.
  Top Story
 

Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness
This paper investigated the influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability. It was found out that the shape and thickness of the intermetallic compounds (IMCs) are among the key factors that affect solder joint reliability after multiple reflow cycles and thermal aging, respectively.
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