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MIL-AERO Weekly Newsletter
  12/11/2018 Current Mil/Aero News: MilAero007 | Mil/Aero Events | Subscriptions
This Week's Feature    
 

Beyond Design: 10 Fundamental Rules of High-speed PCB Design, Pt. 3
Planes are essential in today’s high-speed multilayer PCBs. Unfortunately, the number of power supplies required is increasing dramatically with IC complexity. Now, accounting for them all has become a real challenge. The high number of supplies generally leads to higher layer count substrates. In the past, we used to have more signal routing layers than planes; the opposite is now the case when the majority of stackup layers are reserved for power distribution. Although this increases the cost, it may be a godsend because it provides segregation of critical signals to avoid crosstalk and reduces radiation.

  Top Story
 

What is ESD and Why Should We Worry About It?
The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.

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