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August 10, 2022
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Zac Elliott, Siemens Digital Industries Software |
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In my May column, I talked about the hype around the metaverse and looked at how the technology may be leveraged by manufacturers in the future. Because the metaverse is only starting to be built, the topic was a bit abstract, but the recent announcement of a partnership between Siemens and NVIDIA brings the industrial metaverse one big step closer to (virtual) reality. In this column, I will discuss the new partnership, the technology each party brings to the table, and how manufacturers can benefit from the collaboration.
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Dr. Jennie Hwang, H-Technologies Group |
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After two-year COVID-19 hiatus, I made a point to attend the Berkshire Hathaway (BH) shareholders annual meeting in person, so I could listen to legend Warren Buffett and observe the dynamic of the aspiring people from all walks of life. The event was full of high-spirited, eager attendees; it was quite festive as well. Buffet, now age 91, and his long-time business partner Charlie Munger, age 98, are as sharp, quick-witted, and as humorous as ever. Their deep and profound thought process and broad-based knowledge are inspiring. It was a completely worthy trip; I personally felt intellectually nourished. Their investment wisdom is vividly manifested by the indisputably phenomenal results.
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Critical Application Protection to Withstand Severe Environments - Introducing Parylene coating into our existing conformal coating service offering. Parylene is a premier liquid-free coating applied using a unique chemical vapor deposition process to protect electronics that must endure the most severe environments. Our highly engineered array of surface treatments help prevent premature failure, protect and improve performance of high reliability applications. Parylene’s versatile characteristics make it an ideal candidate for use in mission critical applications in the aerospace and defense, medical, automotive, and electronics markets. See How We Can Optimize Your Applications. |
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Bill Cardoso, Creative Electron |
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One of the most notorious component failures in manufacturing is a faulty ball grid array (BGA). Any line manager or engineer will tell you that there are too many things that can cause a BGA to fail. When a BGA is installed on a circuit board in a factory, it is visually checked for proper alignment. If it passes this simple test some might assume all is well. However, even a board that passes a cursory exam can still be terribly flawed. Because the BGA is a bottom terminating component, examination for quality of the connection cannot be seen with optical tools. To make sure there is a good connection between the BGA and the board, an X-ray inspection is essential. We’ll revisit my favorite X-ray image of a BGA that I shared in my last column and dig into the details of how to address its many problems.
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I-Connect007 Editorial Team |
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IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
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Blackfox Offers In-Person and Online IPC Training and Certification - Blackfox facilities are open for in-person IPC Training and Certification. At Blackfox, we do not take working under current conditions lightly, and have added air purification to our facilities as well as more spacious classrooms. Blackfox can also come to your facility for on-site training and certification. If preferred, Blackfox continues to offer online IPC training and certification in either English or Spanish from the comfort of your home or office. Click for more info. |
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Sales Representatives
Prototron Circuits, a market-leading, quick-turn PCB manufacturer located in Tucson, AZ, is looking for sales representatives for the New England and Northern California territories...
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Technical Support Applications Engineer – Full-Time
Location: Duluth, GA
Koh Young Technology, founded in 2002 in Seoul, South Korea, is the world leader in 3D measurement-based inspection technology for electronics manufacturing...
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| Current SMT007 Magazine Table of Contents |
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After two years in survival mode, it’s time for electronics manufacturers to go on the offensive. Finding relief from pain points should be a mix of both strategic and tactical responses. In this issue, we examine a variety of steps being taken in the industry, from the halls of government to the manufacturing floor—all meant to relieve the pressure and move you forward...
Download the PDF of this magazine to your library.
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- Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
- Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
- Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. Blake Moore and Travis Kelly
- A Framework for Managing Supply Chain Disruption by Chintan Sutaria
- Thriving Through Greater EMS Collaboration by Christopher Peters
- Supply ‘Pain’ Management by Nolan Johnson
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