Check out this week's SMT007 Week Newsletter.
October 21, 2020 

Part 7 of Siemens’ Digital Twin Webinar Series: Optimizing Inspection and Test Engineering

I-Connect007 Editorial Team

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing.” Each of the 12 segments can be viewed in about five minutes.

Have you ever wondered what digital twin is, how it's used, and its benefits? Are you interested in learning ways to optimize and streamline how data flows from design, production planning, process engineering, and manufacturing? Then this micro webinar series is for you!

Throughout this 12-part series, Jay Gorajia from Siemens Industries Software describes how to leverage the digital twin concept—from design to production planning and process engineering—through manufacturing execution and supply chain... More >

 
SMT News & Articles
 
Featured Content

Lean Digital Thread: Accelerating Global New Product Introduction

Sagi Reuven, Siemens Digital Industries

I have previously written about topics related mostly to the shop floor, but my last column swam upstream and covered design for manufacturing:

  1. Design for manufacturing is much easier now
  2. Data collection and the basic questions you can answer
  3. Material management and its impact
  4. Data-driven decisions and micro-solutions in manufacturing

To make this list whole, I need to cover the phase between design to manufacturing: process engineering or simply new product introduction (NPI)... More >

 
 
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Featured Content

Just Ask Greg: Advice on Purchasing SMT Stencils

I-Connect007 Editorial Team

We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, and John Mitchell in our “Just Ask” series. Now, Greg Smith, an SMT007 columnist, gets a chance to answer a question.

Greg Smith has worked in the electronics industry since 1989. He was the owner and president of a stencil manufacturing company for 23 years before joining Fineline Stencil... More >


 

Zulki’s PCB Nuggets: What’s Different Between C2 and C4 for PCB Microelectronics Assembly?

Zulki Khan, NexLogic Technologies, Inc.

In my last column, I talked about flip-chip ball grid array (BGA), or FCBGA, making its grand entrance into PCB microelectronics assembly. But that subject requires a lot more digging to get the full story for OEMs planning highly advanced products that demand PCB microelectronics assembly.

In that regard, C4 and C2 bumps for flip-chip assemblies are among the top techniques that require close attention... More >

 
 
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This Month's Jobs
Chemical Process Engineer

Circuit board fabricator, Firan Technology Group (FTG), is seeking a candidate to fulfill the position of Chemical Process Engineer at their facility located in Fredericksburg, VA...

Apply Now

 
U.S. Sales Manager

Circuit Foil Luxembourg, world-class producer of copper foils for the electronics industry, is seeking a candidate to fill the roll of U.S. Sales Manager...

Apply Now

 

More Job Opportunities

 
 
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Current SMT007 Magazine Table of Contents


Technology Roadmaps

We reached out to a number of organizations doing roadmap work, as well as industry professionals volunteering during their personal time. What’s clear is that creating a technology roadmap is not an easy task. This month (just in time for strategic planning), we talk roadmaps with those who make them and those who use them...
Download the PDF of this magazine to your library.


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Coatings Uncoated! Webinar Series »

 

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