To support students in high school and college by sharing information about the careers the electronics manufacturing industry has to offer, the IPC Education Foundation wanted to ensure that irrespective of the current academic landscape sharing the insights, knowledge and stories from experts should continue to enable students to conveniently attend irrespective of location or circumstance. Webinars have become an extremely useful tool.

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Connectors such as those pictured in Figure 1 are challenging to rework as they generally have a high density, tight spacing of connector pins as well as a ground connection running through the center of the body of the part. The generic term for these types of connectors are surface mount center ground connectors. These surface mount connectors are designed for parallel board-to-board, flex-to-board, and cable-to-board configurations, and are generally compatible with both infrared and forced air convection rework heating methods. Specifically, a popular type of this connector configuration is a mezzanine connector which connects two parallel printed circuit boards in a stacking configuration.

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For our May 2022 issue of SMT007 Magazine, we wanted to learn more about the challenges for high-mix, low-volume EMS firms building high density boards, and how they’re coping with those challenges. What we learned was that the high-density challenges, per se, were actually few and far between. What has been causing new headaches, however, is component packaging because of the unpredictability in the supply chain.

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