I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing.” Each of the 12 segments can be viewed in about five minutes.

Have you ever wondered what digital twin is, how it's used, and its benefits? Are you interested in learning ways to optimize and streamline how data flows from design, production planning, process engineering, and manufacturing? Then this micro webinar series is for you!

Throughout this 12-part series, Jay Gorajia from Siemens Industries Software describes how to leverage the digital twin concept—from design to production planning and process engineering—through manufacturing execution and supply chain... More >

I have previously written about topics related mostly to the shop floor, but my last column swam upstream and covered design for manufacturing:

1. Design for manufacturing is much easier now
2. Data collection and the basic questions you can answer
3. Material management and its impact
4. Data-driven decisions and micro-solutions in manufacturing

To make this list whole, I need to cover the phase between design to manufacturing: process engineering or simply new product introduction (NPI)... More >

We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, and John Mitchell in our “Just Ask” series. Now, Greg Smith, an SMT007 columnist, gets a chance to answer a question.

Greg Smith has worked in the electronics industry since 1989. He was the owner and president of a stencil manufacturing company for 23 years before joining Fineline Stencil... More >

In my last column, I talked about flip-chip ball grid array (BGA), or FCBGA, making its grand entrance into PCB microelectronics assembly. But that subject requires a lot more digging to get the full story for OEMs planning highly advanced products that demand PCB microelectronics assembly.

In that regard, C4 and C2 bumps for flip-chip assemblies are among the top techniques that require close attention... More >