Modern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.

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If you want a clean view of where thermal substrates and ceramic/thick-film electronics are headed, follow the heat. Power density is moving up and to the right across industries: EV traction inverters, fast chargers, AI data centers, radar, satellite payloads, medical imaging, and high-brightness LEDs. The next five years will be defined by designs that treat thermal performance as a first-order constraint, not an afterthought. Here’s what that means in practice.

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As Starlink surpasses 8 million users of its network and terminals for home and business broadband access, STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and SpaceX celebrate ten years of collaboration driving innovation with co-design of custom-made components for satellite communication.

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