TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.

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I’m regularly on Capitol Hill, talking about the foundational importance of PCBs and other essential pieces of the electronics supply chain. I find that policymakers work hard to make informed decisions that affect our $6 trillion industry, yet they don’t always have a complete picture of how interconnected our industry has become. A component decision in Arizona can ripple through a PCB line in Guadalajara, a materials plant in Penang, and ultimately the manufacturers that depend on both. That’s why the global electronics industry needs a unified, coordinated voice to help policymakers understand those connections before decisions are made, so policies strengthen the entire electronics supply chain rather than one segment at the expense of another. 

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Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

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