Modern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.

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The compute power of artificial intelligence is revolutionizing nearly everything it touches, yet the tremendous demand and limited supply have put increasing pressure on energy sources to keep up the pace. Semiconductor fabs and other manufacturing businesses, in particular, must find innovative solutions to optimize their energy use and management. Power may be the hard barrier that will stop all progress if we can't find viable solutions. At SEMICON West, Mark Bidinger, president of commercial and industrial segments at Schneider Electric, shared his insights into this issue and potential solutions.

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At SEMICON West this year, I had the pleasure of speaking with Doug Schardt, Komori America’s director of Printed Electronics Business, who discussed how Komori has evolved from a traditional printing company to a leader in modern printing solutions, with a specific focus on printed electronics (PE) equipment and materials. He details the potential for Komori’s gravure offset printing, research into conductive inks, and why he believes AI chips are driving the future of printed electronics.

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