The Pan-European Design Conference has quickly established itself as a premier event for the European electronics design community. Now in its third year, PEDC, set for Jan. 27-28, 2027, in Amsterdam, has already attracted a record number of technical paper submissions. In this interview, Susan Kayesar, a product manager at Siemens who is an active participant in IPC design standards, discusses the upcoming conference and the trends driving its continued growth.

I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part podcast series. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.

A standard CubeSat (nanosatellite) leaves an engineer with almost no room for compromise. A 1U unit is a 10 cm cube; even a 6U or 12U bus measures its budget in grams and cubic centimeters, not the kilograms and racks available to a traditional satellite. Every wire harness, connector, and mounting bracket is mass and volume that could otherwise carry a sensor, a radio, or extra battery capacity. That pressure is what has pushed flexible printed circuits out of the wiring harness and onto the structure itself, turning the body panels that form a CubeSat's outer skin into functional electronic assemblies.