Vienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.

High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.

It’s a great time to be a PCB designer. The job is more complex than ever, but it's also a lot of fun. We can only wonder what the PCB designers of 1975 would think about today’s typical workday. What will the designer's job look like in the future? There has been a move toward working remotely, driven partly by the COVID pandemic and partly by reality: Many experienced designers simply will not relocate, even for a more lucrative job.