Check out this week's Design007 Week Newsletter.
April 17, 2025 

Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead

Jerome Larez, CEE PCB

High density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.


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Featured Content

Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology

Real Time with...IPC APEX EXPO

Andy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.


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Featured Content

Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues

Matt Stevenson, ASC Sunstone Circuits

If you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.


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Designers Notebook: Layer Stackup Planning for RF Circuit Boards

Vern Solberg, Consulting

When designing multiple layer circuits requiring impedance control, the circuit board designer will work closely with an engineering specialist cognizant of RF printed circuit board design and layout, including mixed-signal applications.


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This Month's Jobs
Various Positions

For 40 years, Technica USA has been providing products, equipment, and services to the printed circuit board fabrication and assembly markets...

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Sales Applications Engineer

The Sales Applications Engineer is responsible for working with customers and managing inquiries to result in an accurate quote for business and ongoing customer support...

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Current Design007 Magazine Table of Contents


Designing Through the Noise

In this issue, our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm...
Download the PDF of this magazine to your library.


FEATURES:

  • Material Selection and RF Design with Alun Morgan
  • EDA Tools and RF Design Techniques with David Vye
  • New RF Materials Offer RF Designers Options with Brent Mayfield
  • The Right Blend: Mixed Wireless Technologies, by Kirsten Zima
  • RF PCB Design Tips and Tricks, by Cherie Litson



 
 
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