Check out this week's Design007 Week Newsletter.
October 17, 2024 

Connect the Dots: Designing for Reality—Pattern Plating

Matt Stevenson, Sunstone Circuits

In the previous episode of I-Connect007’s "On the Line with…" podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.


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Back to School With Jonathan Studinka

Andy Shaughnessy, Design007 Magazine

At the Anaheim Electronics & Manufacturing Show, I spoke with Jonathan Studinka, a student in John Watson’s PCB design class at Palomar College. In this interview, Jonathan shares his experience, highlighting how John’s class has broadened his understanding of PCBs and sparked his interest in mechatronics. Despite having no prior electronics training, Jonathan says he finds the coursework manageable by taking it step by step.


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Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

Dean Neuburger, Sheldahl Flexible Technologies

Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.


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Current Design007 Magazine Table of Contents


Partial HDI

Partial HDI refers to the targeted use of HDI, usually on one section of one layer of the board. It offers designers an avenue for escape routing from BGAs with a pitch of ...
Download the PDF of this magazine to your library.


FEATURES:

  • Partial HDI: A Complete Solution, with Kris Moyer
  • Implementing HDI and UHDI Circuit Board Technology, by Vern Solberg
  • Novel Ultra HDI Architectures, by Happy Holden
  • One Partial HDI Technique: mSAP, with Chris Hunrath
  • Partial HDI: A Delicate Balance, with Stephen Chavez



 
 
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