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I-Connect007 Daily Newsletter
2/24/2017


     






PCB007

Trouble in Your Tank: Metalizing Difficult-to-Plate Substrates
Metalizing materials such as polyimide used for flexible circuitry provides a significant challenge for process engineers. Conventional electroless copper systems often required pre-treatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering.

 
SMT007

RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results
Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.

 

Electronics Industry News - EIN007

Thinness Like an Atom: a Revolutionary Semiconductor for Electronics
Semiconductors, as thin as an atom, are no more future music. The Bayreuth physicist Prof. Dr. Axel Enders has developed a two-dimensional material together with US-American and Polish partners, which could revolutionize electronics.

 
Market News
 

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