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I-Connect007 Daily Newsletter
7/26/2016


     






SMT007

Industry 4.0: Making the First Move
Many companies now have active Industry 4.0, Internet of Manufacturing, or smart factory projects. In each case, different approaches were taken that appeared to best fit the project requirements and that would deliver the intended benefits versus the cost and effort investment needed. However, there is no best solution. This article explains why.

 
PCB007


Using the Type 1 Gauge Study to Assess Measurement Capability
Measurement capability is a critical aspect of ensuring product quality, therefore a measurement system must be assessed before being used on products. Understanding how to assess measurement capability becomes critical. The Type 1 Gauge study is typically the first step in a measurement system analysis program. Type 1 Gauge parameters are explained, and a worked example using electroless nickel immersion gold (ENIG) is provided.

 

Electronics Industry News - EIN007

Ultra-flat Circuits Will Have Unique Properties
The Rice lab of theoretical physicist Boris Yakobson analyzed hybrids that put 2-D materials like graphene and boron nitride side by side to see what happens at the border. They found that the electronic characteristics of such “co-planar” hybrids differ from bulkier components.

 
Market News
 

SMT Magazine
SMT Magazine | Flip | PDF | Table of Contents
Features: PCBA Test and Inspection

Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements, Alpha
Addressing New Testing and Inspection Challenges, I-Connect007
Condensation Testing—A New Approach, Electrolube Ltd
Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth, Goepel
Package-on-Package Warpage Characteristics and Requirements, Intel & iNEMI



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