Joel Scutchfield, general manager and director of sales for Koh Young America, shares with Nolan Johnson new innovations from Koh Young including the company's next-generation GUI software, evolution of the KSmart software, and investigative R&D for advanced packaging. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

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The main task of the final finish is to protect the copper pad from tarnishing or oxidation while simultaneously keeping the surface active for the assembly. Electroless nickel/immersion gold (ENIG) is a widely accepted finish in the market that provides a good solderability and capability for Al-wire bonding. A main function of the gold layer is to prevent the oxidation of the nickel layer.

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Pete Starkey talks with Chris Hrusovsky of International Electronic Components (IEC) about the work they have done with their business partners, Sigma Mecer & ASS-Luippold, and the next generation of personnel within IEC. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

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