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November 18, 2019 

Merger and Acquisition Trends

I-Connect007 Editorial Team

In this interview with the I-Connect007 Editorial Team, Green Circuits’ Joe O’Neil breaks down the current merger and acquisition (M&A) market in the electronics manufacturing space and the industry trends that affect it. Joe also gives his advice on best practices for the negotiating table from both the buyer’s or seller’s perspective.

Nolan Johnson: Dan, since you are particularly qualified to talk about M&A issues, I’m excited to have you lead this.

Dan Feinberg: It has been a while, but I was involved in a number of M&As as well as divestitures back in the ‘80s and ‘90s both as the acquiree and acquirer... More >

 
Industry News
 
 

 

Vertical Conductive Structures, Part 4: Tuning Your Signal Performance

Joan Tourné, NextGIn Technology BV

The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.

This study focuses on developing a layer transition element that minimises the loss and dispersion. We will use VeCS-2 technology (blind/hybrid) construction.

The advantage of using a stitching via is that we can use “traditional” orthogonal routing, which is very efficient in signal layer utilization... More >

 
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EIN - Electronics Industry News Highlights

 
Featured Columnists

 
   
 
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