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I-Connect007 Daily Newsletter
7/15/2019


     






PCB007

Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

 
SMT007

Surface Treatment Enabling Low-Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

 

Electronics Industry News - EIN007

NASA Celebrates 50th Anniversary of Historic Moon Landing with Live TV Broadcast, Events
NASA will celebrate the 50th anniversary of the historic Apollo 11 Moon mission and look to the future of exploration on the Moon and Mars with a live, two-hour television broadcast Friday, July 19, and partner-led events taking place across the country from July 16 through July 20.

 
Market News
 

SMT007 Magazine
SMT007 Magazine | Preview | PDF | Contents
Features: Reliability vs. Failure

Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz
Low-temperature SMT Solder Evaluation by Howard “Rusty” Osgood, et al.
Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala
Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee
Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Y. K. Song, V. Bukva, and R. Wong



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