Check out today's I-Connect007 Daily Newsletter.
April 9, 2021 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Andy Shaughnessy, I-Connect007

It’s that time again…the weekend. Fin de semana. Zh?umò. Wochenende. Didn’t this seem like a long week?

In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show... More >

Industry News


Polar Instruments Driven by Customer Demand

Andy Shaughnessy, Design007 Magazine

Andy Shaughnessy recently spoke with Geoffrey Hazelett, vice president of sales for Polar Instruments, about the virtual IPC APEX EXPO and the eventual return of live trade shows and conferences. They also discussed some of the company’s newest releases, many of which came about through customer demand... More >


Real Time with... provides in-depth, exclusive, industry event coverage
We invite you to read, watch, and listen to our Real Time with...IPC APEX EXPO 2021 interviews produced by I-Connect007 in partnership with the IPC, available now at For complete coverage, download Show & Tell Magazine 2021, our celebrated special annual magazine. We compile and highlight all of our show-related content and deliver it to current my I-Connect007 registrants.

Barry Olney’s High-Speed Simulation Primer

Barry Olney, In-Circuit Design Pty Ltd

The I-Connect007 editorial team recently spoke with Barry Olney of iCD about simulation. Barry, a columnist for Design007 Magazine, explains why simulation tools can have such a steep learning curve, and why many design engineers are still not using simulation on complex high-speed designs... More >

Design Circuit: IPC-2231A—Insights from the IPC 1-14 DFX Subcommittee

Patrick Crawford, IPC

In mid-2019, IPC released IPC-2231 DFX Guidelines, a comprehensive guide for establishing best practice methodology in developing a formal DFX (design for excellence) process for laying out printed boards and assemblies. This process can be established at a systemic level—integrated into the workflow of departments of companies—or adhered to as an individual designer... More >


Free eBook Highlights Objective Evidence for Process Validation - Today’s high-reliability electronics require accurate test methods. Learn to achieve electrochemical reliability with the latest offering in the I-007eBook library: The Printed Circuit Assembler's Guide to... Process Validation. Respected author Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability can be achieved by using both CAF and SIR testing. Download your free copy today!
EIN - Electronics Industry News Highlights

Featured Columnists


Become a Thermal Management Design Expert - Learn how to beat the heat in your designs with The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective! This book serves as a desk reference for designers on the most current techniques and methods from a PCB fabrication perspective. Want to ensure manufacturability, cost-effective solutions, and successful product launches? Download your free copy now!

JobCONNECT007 Featured Listings

Customer Service Representative, UK

We are looking to expand our UK Customer Service/Internal Sales team. As Customer Service Representative you will provide great sales and customer service support and respond to the needs of clients from industries including Aerospace, Defence, Automotive and Pharmaceutical...

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Field Sales Representative

Field Sales Representative serves as lead sales contact and customer advocate to maintain existing sales and to drive new qualifications and sales of products and services through effective account management and coordination of efforts throughout Indium Corporation’s Metals, Compounds, Solar and Reclaim (MCSR) organization...

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