As design complexity and density increases, it sometimes requires the designer to leverage different via technologies to successfully route into larger pin count devices while maintaining the highest level of signal integrity. Using through-hole vias can take up a lot of valuable board space; moving to smaller blind vias reduces the via size but will require larger buried vias to complete the connections deeper in the board. Another costly alternative is using every layer interconnect (ELIC) technology with each layer pair having its own copper-filled, laser-drilled microvias... More >

Abstract

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications... More >