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9/18/2018

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SMT007
Artificial Intelligence: Super-Exciting, Ultra-Competitive Artificial intelligence (AI) and machine learning (ML) have become common everyday words, however, the present reality and future potential are yet to evolve. This article looks into the key considerations and strategies to better leverage these trends that are expected to transform the manufacturing world.
	SMT007 Highlights Koh Young Technology Highlighted Meister System at Semicon Taiwan VirTex Enterprises Acquires PPI-Time Zero SemiGen Strengthens PCB Assembly, Test Capabilities Compass Group Equity Partners to Form Compass Electronics Group
PCB007
PCB Design Challenges: A Package Designer’s Perspective The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.
	PCB007 Highlights Aismalibar to Present FASTHERM at Ford Advanced Lighting Innovation Expo 2018 MacDermid Enthone Advanced Electronics Solutions to Present at the 2018 SMTA International Conference September Issue of Design007 Magazine Available Now PCB Solutions Names National Essay Scholarship Winner

Electronics Industry News - EIN007
Device Uses Graphene to Convert Light to Electrical Signals A team of researchers has developed a device that uses the material graphene to detect mid-infrared light and efficiently convert it to electrical signal at room temperature. It’s a breakthrough that could lead to better communications systems, thermal imagers and other technologies.
	Electronics Industry News Highlights Near-Infrared Laser Systems for Monitoring Forest Dynamics from Space Pass Final Tests Compact Fiber Laser May Enable Wearable Tech and Better Endoscopes A Wearable Device for Regrowing Hair BEX Introduces New Line of Nozzles Sound Offers New Directions in Integrated Photonics
Market News

	Micro-Inverter Market Worth $5.88 Billion by 2023 Seven IC Products to Outpace Total 16% IC Market Growth in 2018 Energy Taiwan: Inaugural International Event Aims to Speed Clean Energy Technology Innovation New Fabs Invest Over $220 Billion; 2019 to Mark All-Time Spending High Four Providers of 3D Printing Solutions Named IDC Innovators

PCB007 Magazine

PCB007 Magazine | Preview | PDF | Contents

Features: SAP, mSAP, SLP

SLP: The Next Level of Technology, by Patty Goldman
Additive Electronics: PCB Scale to IC Scale, by Tara Dunn
The Changing Shape of the HDI Market, by Roger Massey
Catching up with… James Rathburn, President, HSIO Technologies, by Dan Beaulieu
Smartphone Substrate-Like PCBs Will Revolutionize the IC substrate and PCB Markets, by Emilie Jolivet

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