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   11/9/2021       • PCB007.com   • SMT007  • I-007e  • Subscribe: my I-Connect007

Mycronic at Productronica 2021

More process data. Faster innovation cycles. Smarter factory systems. As the pace of change accelerates, we’re convinced that tomorrow’s PCB assembly environment should be a simpler place. A place where no build schedule is too complex. No defect goes unprevented. And no production is left standing still. From naked board to coated product – and everything in between.

At Productronica, you’ll have the chance to bring us your bottlenecks, quality issues and integration challenges. Join us in Hall A3, Booth 342, on November 16-19 and put our process experts to the test.

Together, we can build the future of electronics assembly.

Rogers Corporation Presents SpeedWave™ 300P Ultra-Low Loss Prepreg

Rogers expands its range of high performance bondplies for use in 5G mmWave, automotive radar, defense and high speed digital applications. SpeedWave 300P prepreg system offers a dielectric constant of 3-3.3 and a low dissipation factor of .0019-.0022 with a variety of glass styles and resin contents to match multiple stack-up options.

SpeedWave™ 300P prepreg has excellent thermal reliability, fill and flow, and low Z-axis CTE for the most demanding high count MLB designs requiring multiple sequential laminations. With excellent CAF resistance and compatible with standard processing, SpeedWave 300P prepreg can be used with a wide range of different laminates.
Visit Rogers in Hall B3, Booth 401.

Electrolube to Launch a New Thermal Gap Filler with 6.0 W.m/K

To increase electronics reliability in the harshest of environments, the global electro-chemicals manufacturer, Electrolube, part of MacDermid Alpha Electronics Solutions, will launch its most exciting conformal coating and thermal management innovations yet at this year’s Productronica Munich, November 16-19.

Visit Electrolube in Hall A4, Booth 466 and online to learn more.

Be sure to download your free copy of Electrolube's book, The Printed Circuit Assembler's Guide to… Conformal Coatings for Harsh Environments, and watch the micro webinar series Coatings Uncoated!

AGFA’s DiPaMAT: Set to Grow Your Business, Not Your Footprint

As a world leading PCB film supplier and long-standing global player in inkjet for the graphics industry, Agfa now offers its DiPaMAT inkjet inks for applications in PCB. DiPaMAT inks offer the required image quality while enriching it with all the benefits of an additive process:

  • The flexibility to seamlessly switch between board designs
  • The affordability of single piece and large production runs
  • A simplified production process
  • A waste-free process using solvent-free inks

DiPaMAT inks comply with the demanding conditions of PCB making processes and meet the stringent performance requirements of the most critical end applications. For information, visit Agfa online or at the show in Hall B3, Booth 443.

Top Quality & Maximum Flexibility – Reflow Soldering System VisionXP+ Vac

The most powerful system, the VisionXP+, now makes convection soldering with or without a vacuum even more efficient! At productronica, we will present the highlights of VisionXP+. Besides already proven EC fan motors, which make the system both quieter and more sustainable, it also includes reduced nitrogen consumption and a cooling zone.

In addition, an instrument for monitoring thermal profiles during soldering is integrated into the VisionXP+ via the ViCON system software: ProMetrics. It checks how well the previously created profile corresponds to the required predefined specifications. Visit Rehm online or at the show in Hall A4, Booth 335 to learn more.

New eBook: The Printed Circuit Assembler’s Guide to… Solder Defects

The Printed Circuit Assembler’s Guide to… Solder Defectsthe latest title in the
I-007eBook library—is specifically dedicated to educating the PCB assembly sector and serves as a valuable resource for people seeking the most relevant information available.

Indium’s Christopher Nash and Dr. Ronald C. Lasky address the top six defects, as well as how to avoid them. This includes minimizing voiding, head-in-pillow and non-wet opens, and tombstoning of passive components. This book will be especially beneficial to PCB assemblers in improving their processes and the reliability of the end-product, eliminating field failures, and reducing costs. Download your free copy today!


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Barb Hockaday

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Magazine Editor
Nolan Johnson
+1 503-597-8037
nolan@iconnect007.com

Technical Editor
Pete Starkey

+44 (0) 1455 293333
pete@iconnect007.com


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