all4-PCB - Your PCB Industry Solution Provider for 20 Years!

All4-PCB offers PCB and chem-milling customers innovative equipment and high-quality materials, delivering process solutions and reliable technical support for a range of operations including:

Wet Process, Imaging, Via-Fill, Lamination, Mechanical and Laser Drill & Rout, Inkjet Printing, Plasma Treatment, Electrical Testing and Final Processes.

Connect with us in Booth 4824 and online at all4-PCB.us or email us at info@all4-PCB.us.

SCHMOLL and BURKLE Offer Cutting Edge Solutions for PCB Fabricators

Schmoll America and Burkle North America team up to provide PCB fabricators leading edge technologies for tomorrow’s manufacturing. With years of technological development and experience behind it, our PCB equipment will take your processes to the next level. Stop by and see how our lamination, drilling, imaging, and laser equipment can help you make that leap!

Visit Burkle and Schmoll online and on the show floor in Booth 4432.

IEC—Celebrating 25 Years of Providing All Your PCB Production Solutions

Come visit with your IEC account manager, more of our fantastic team members, and many other IEC supply partners on the show floor. You can find us at the following booths:

Atg - 4829, DIS - 4729, Dynachem - 4215, Pluritec - 4832, Rogers Corporation - 4307, Schmid - 4632, Sigma-Mecer - 4748, and SUSS - 4153

For information on arranging a meeting with IEC and your account manager at the show, please contact blaine.mclellan@ieccan.com.

Orbotech Neos™ 1600 High-Capacity Inkjet for Solder Mask Printing

KLA’s next-generation, high-capacity inkjet solution for PCB solder mask features a 100% additive printing method. The eco-friendly Orbotech Neos 1600 eliminates process steps, consuming less power, materials, and chemicals. Powered by KLA's Structural Printing™ and DotStream Pro™ Technologies, this next-generation model offers nearly double the capacity of Orbotech Neos™ 800.

Join us at IPC APEX EXPO 2024 at Booth 4845 or click here to learn more.

Vertical Processing with INFINITYLINE V+

The vertical processing of printed circuit boards and substrates using transport clamping frames opens up new possibilities. Not only the contactless transport, but also the homogeneous treatment characterizes this machine type. Most different wet-chemical processes can be implemented and easily integrated. Cleanroom compatibility dependent on equipment options and individually configurable due to modular design.

The InfinityLine V+ supports all requirements of Industry 4.0 by providing interfaces to customers’ individual manufacturing execution system (MES). It meets all industrial standards worldwide. Furthermore, it has an option for mature SECS/GEM interfaces.

Visit SCHMID at Booth 4632 and online at schmid-group.com.

Full Scale Automation and Smart Factory Solutions from Technica

Technica will feature full-scale automation solutions with the cooperation of its supply partners. Make your production hours count, integrating reliable hardware and software automation solutions where it starts.

Consider automation for certain purposes, such as lowering operating costs, improving work safety, reducing factory lead times, increasing production output, improving quality, or achieving a smart factory environment. Understanding your short- and long-term goals will determine the hardware and software tools that will be required to meet your goals and achieve a desired outcome. Visit us at Booth 4215 or online for more information.

Uyemura: Global Leader in Final Finishes

Uyemura and MEC are featuring several elite final finish technologies at APEX this year. Included are EtchBond micro-roughening for high-adhesion applications; Anisotropic Etchants; Flash Etchants for SAP; Differential Etchants for mSAP, and Micro Via Fill. Also featured: TWX-42 RAIG (Reduction-Assisted Immersion Gold) for 6-8 µm gold deposits with zero nickel corrosion; Talon 3 electroless palladium; TPD-23 electroless pure palladium for ENEPIG and wire bond applications, EPIG/EPAG and Direct Immersion Gold for dense, non-porous deposits up to 0.3μm. (DIG meets the highest standards for HF and fine pattern compatibility!)

Visit us in Booth 4809 and online at uyemura.com.