all4-PCB: Your PCB Industry Solution Provider for 20 Years!

Since 2002, all4-PCB has been a trusted supplier of PCB equipment and materials, offering innovative, reliable process solutions with the support of industry veterans. We provide equipment and services for the PCB, Advanced Packaging Substrate, LTCC, and Chemical Milling industries. Our dedicated team of engineers and extensive parts inventory in Glendale, CA, ensures technical support. With expertise in Via Fill, Imaging, Fabrication, Process Automation, and more, we offer complete process solutions, not just equipment.

For more info, visit all4-PCB.us or email us at info@all4-PCB.us and be sure to visit us in Booth 4732.

Burkle’s Multilam Lamination System: The Ultimate Solution for the PCB Industry

Transform PCB Manufacturing with Burkle North America's Advanced Lamination Solutions. As the demand for high-quality PCBs soars, Burkle North America leads the way with state-of-the-art lamination technology. From our innovative Workcell concept to scalable mass lamination capabilities, we deliver unmatched precision, efficiency, and reliability. Experience seamless Industry 4.0 integration, real-time process control, and expert support designed to optimize your production. Whether you're scaling operations or tackling complex designs, Burkle's solutions empower you to achieve peak performance.

Visit us in Booth 4424, on our website, or LinkedIn to discover how our cutting-edge PCB lamination lines can transform your manufacturing process.

Comprehensive PCB & IC Substrate Manufacturing Solution

GreenSource Engineering’s core skills have been honed and developed by completing 3 significant ‘start to finish’ projects. Our confidence is such that we are about to embark on a specialized IC substrate facility that will be a trail-blazing project for the U.S.

GSE’s core skills are:

• Fab design and layout, incorporating the most competent suppliers in the industry
• Wet process tools with both RESOLUTION\u2122 H and RESOLUTION\u2122 V tools for horizontal and vertical processing, respectively
• Design and supply of production-proven ZLD and MLD water recycling systems

Visit us in Booth 4841 and online at GreenSource Engineering - Comprehensive PCB Manufacturing Solutions.

IEC—Dedicated to Providing All Your PCB Production Solutions

Come visit with your IEC account manager, more of our fantastic team members, and many other IEC supply partners on the show floor. You can find us at the following booths:

atg - Booth 4844, Pluritec - Booth 4844, and Rogers Corporation - Booth 4120

For information on arranging a meeting with IEC and your account manager at the show, please contact blaine.mclellan@ieccan.com.

Setting the Standard for PCB Manufacturing Support Across North America

Schmoll America, the North American division of Schmoll Maschinen, is a leader in delivering premium service to the region’s PCB manufacturing industry. Since its inception in April 2024, the team has expanded by more than 50% and now boasts a network of 24 highly skilled engineers strategically positioned across North America. Renowned for their precision, reliability, and swift response times, Schmoll America provides outstanding support at every stage of the customer journey. Driven by a commitment to innovation and excellence, the company provides fast, dependable assistance and tailors advanced solutions to meet the unique needs of PCB manufacturers.

Visit Schmoll America in Booth 4622 to learn more and follow us on LinkedIn.

Full Scale Automation and Smart Factory Solutions from Technica

Technica and its supply partner SAA, will host their Automation Design Center during APEX to discuss simple or full-scale automation solutions for PCB Fab, Substrate and Semiconductor manufacturing. In addition, Technica will introduce their own line of material handling equipment by Electro Design for PCB Assembly and Conformal Coating. Make your production hours count, integrating reliable hardware and software automation solutions where it starts. Understanding your short- and long-term goals will determine the hardware and software tools that will be required to achieve the desired outcome

Other automation partners include Inovaxe (smart inventory storage systems), Critical Manufacturing (MES for industry 4.0), and Cogiscan (factory solutions software). Visit us at Booth 4024 or online at Technica.com for more information.

Industry’s Roadmap for Maximum HDI/UHDI Yields

The Uyemura-MEC Roadmap for maximum HDI/UHDI yields includes Etchbond micro-roughening, anisotropic etchants for sub-40-micron circuitry patterns, differential and flash etchants for mSAP/SAP, and high-frequency, fine-pitch final finishes, including EPIG and IGEPIG. Talon 3, an electroless Phos Palladium, and TPD-23, a pure palladium, are foundational for ENEPIG, EPIG, and EPAG final finishes. Direct immersion gold meets the highest standards for HF and fine pattern compatibility. TWX-42 deposits 6-8 µm gold. For the substrate market, Uyemura introduces direct glass metallization, electrolytes including electroless copper, copper through-glass via, RDL plating, copper post-plating, and tin-silver.

Visit Uyemura in Booth 4413 and online at uyemura.com to learn more.